Display panel and manufacturing method thereof, and display device

ABSTRACT

Provided are a display panel and a manufacturing method thereof, and a display device, relating to the field of display technology. The display panel includes a display region and a non-display region. The non-display region is located at the periphery of the display region. The display panel includes a substrate, a first insulating film, and a second insulating film. The first insulating film is located in the display region and the non-display region and located on a side of the substrate. The edge of the first insulating film is located at a first cutoff position in the non-display region. The second insulating film is located in the display region and the non-display region and located on a side of the first insulating film facing away from the substrate. The edge of the second insulating film is located at the first cutoff position.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to Chinese Patent Application No.202210916225.6 filed Aug. 1, 2022, the disclosure of which isincorporated herein by reference in its entirety

TECHNICAL FIELD

The present disclosure relates to the field of display technology and,in particular, to a display panel and a manufacturing method thereof,and a display device.

BACKGROUND

With many advantages such as a thin body, power saving, and noradiation, a flat panel display device has been widely applied. Theexisting flat panel display device mainly includes a liquid crystaldisplay device and an organic light-emitting display device. In a flatpanel display device, what performs a display function is mainly adisplay panel.

When a display panel is prepared, a mask exposure process is usuallyused to form each film layer by layer.

SUMMARY

The present disclosure provides a display panel and a manufacturingmethod thereof, and a display device to reduce the process flow of thedisplay panel in the manufacturing process, improve the productioncapacity of the display panel, and reduce the manufacturing cost of thedisplay panel.

In a first aspect, an embodiment of the present disclosure provides adisplay panel. The display panel includes a display region and anon-display region. The non-display region is located at the peripheryof the display region. The display panel includes a substrate, a firstinsulating film, and a second insulating film.

The first insulating film is located in the display region and thenon-display region and located on a side of the substrate. The edge ofthe first insulating film is located at a first cutoff position in thenon-display region.

The second insulating film is located in the display region and thenon-display region and located on the side of the first insulating filmfacing away from the substrate. The edge of the second insulating filmis located at the first cutoff position.

In a second aspect, an embodiment of the present disclosure provides amanufacturing method of a display panel. The display panel includes adisplay region and a non-display region. The non-display region islocated at the periphery of the display region. The method includes thesteps below.

The substrate is provided.

A first initial film covering the display region and the non-displayregion is formed.

The second insulating film covering the display region and thenon-display region is formed. The edge of the second insulating film islocated at the first cutoff position in the non-display region.

The second insulating film is used as a mask. At least part of the firstinitial film in the non-display region is etched and removed to form thefirst insulating film. The edge of the first insulating film is locatedat the first cutoff position.

In a third aspect, an embodiment of the present disclosure provides adisplay device. The device includes the display panel described in thefirst aspect.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a top view of a display panel according to an embodiment ofthe present disclosure.

FIG. 2 is a section view taken along section line AA′ of FIG. 1 .

FIG. 3 is a top view of another display panel according to an embodimentof the present disclosure.

FIG. 4 is a section view taken along section line BB′ of FIG. 3 .

FIG. 5 is a top view of another display panel according to an embodimentof the present disclosure.

FIG. 6 is a section view taken along section line CC′ of FIG. 5 .

FIG. 7 is a top view of another display panel according to an embodimentof the present disclosure.

FIG. 8 is a section view taken along section line DD′ of FIG. 7 .

FIG. 9 is a top view of another display panel according to an embodimentof the present disclosure.

FIG. 10 is a section view taken along section line EE′ of FIG. 9 .

FIG. 11 is a top view of another display panel according to anembodiment of the present disclosure.

FIG. 12 is a section view taken along section line FF′ of FIG. 11 .

FIG. 13 is a top view of another display panel according to anembodiment of the present disclosure.

FIG. 14 is a section view taken along section line GG′ of FIG. 11 .

FIG. 15 is a section view of another display panel according to anembodiment of the present disclosure.

FIG. 16 is a section view of another display panel according to anembodiment of the present disclosure.

FIG. 17 is a section view of another display panel according to anembodiment of the present disclosure.

FIG. 18 is a section view of another display panel according to anembodiment of the present disclosure.

FIG. 19 is a section view of another display panel according to anembodiment of the present disclosure.

FIG. 20 is a flowchart of a manufacturing method of a display panelaccording to an embodiment of the present disclosure.

FIG. 21 is a flowchart of a manufacturing method of a display panelaccording to an embodiment of the present disclosure.

FIG. 22 to FIG. 30 are diagrams of the manufacturing process of adisplay panel according to an embodiment of the present disclosure.

FIG. 31 is a flowchart of a manufacturing method of another displaypanel according to an embodiment of the present disclosure.

FIG. 32 to FIG. 40 are diagrams of the manufacturing process of anotherdisplay panel according to an embodiment of the present disclosure.

FIG. 41 is a diagram of a display device according to an embodiment ofthe present disclosure.

DETAILED DESCRIPTION

Hereinafter the present disclosure is further described in detail inconjunction with the drawings and embodiments. It is to be understoodthat the specific embodiments set forth below are intended to illustrateand not to limit the present disclosure. Additionally, it is to be notedthat, for ease of description, only part, not all, of structures relatedto the present disclosure are illustrated in the drawings.

FIG. 1 is a top view of a display panel according to an embodiment ofthe present disclosure. FIG. 2 is a section view taken along sectionline AA′ of FIG. 1 . Referring to FIGS. 1 and 2 , the display panelincludes a display region 01 (the region inside the dashed box in FIG. 1) and a non-display region 02 (a region outside the dashed box in FIG. 1). The non-display region 02 is located at the periphery of the displayregion 01. The display panel includes a substrate 10, a first insulatingfilm 11, and a second insulating film 12. The first insulating film 11is located in the display region 01 and the non-display region 02. Thefirst insulating film 11 is located on a side of the substrate 10. Theedge of the first insulating film 11 is located at a first cutoffposition L1 in the non-display region 02. That is, the first insulatingfilm 11 extends from the display region 01 to the non-display region 02and is cut off at the first cutoff position L1 in the non-display region02. The second insulating film 12 is located in the display region 01and the non-display region 02. The second insulating film 12 is locatedon the side of the first insulating film 11 facing away from thesubstrate 10. The edge of the second insulating film 12 is located atthe first cutoff position. That is, the second insulating film 12 coversthe first insulating film 11. The second insulating film 12 extends fromthe display region 01 to the non-display region 02 and is similarly cutoff at the first cutoff position L1 in the non-display region 02.

In the display panel provided by this embodiment of the presentdisclosure, the first insulating film 11 and the second insulating film12 are each cut off at the first cutoff position L1 in the non-displayregion 02, and the edge of the first insulating film 11 and the edge ofthe second insulating film 12 are flush. In this manner, during themanufacturing process of the display panel, when a first initial film isetched to form the first insulating film 11, the second insulating film12 may be used as a mask for etching the first initial film. Thus, thereis no need to specially manufacture a mask when the first initial filmis etched, so that a process is saved, and the process flow of thedisplay panel in the manufacturing process is reduced. Moreover, theproduction capacity of the display panel is improved, and themanufacturing cost of the display panel is reduced.

FIG. 3 is a top view of another display panel according to an embodimentof the present disclosure. FIG. 4 is a section view taken along sectionline BB′ of FIG. 3 . Referring to FIGS. 3 and 4 , the display panel alsoincludes a third insulating film 13 and a fourth insulating film 14. Thethird insulating film 13 is located in the display region 01 and thenon-display region 02. The third insulating film 13 is located betweenthe first insulating film 11 and the substrate 10. The edge of the thirdinsulating film 13 is located at a second cutoff position L2 in thenon-display region 02. That is, the third insulating film 13 extendsfrom the display region 01 to the non-display region 02 and is cut offat the second cutoff position L2 in the non-display region 02. Thefourth insulating film 14 is located in the display region 01 and thenon-display region 02. The fourth insulating film 14 is located betweenthe third insulating film 13 and the first insulating film 11. The edgeof the fourth insulating film 14 is located at the second cutoffposition L2. That is, the fourth insulating film 14 covers the thirdinsulating film 13. The fourth insulating film 14 extends from thedisplay region 01 to the non-display region 02 and is similarly cut offat the second cutoff position L2 in the non-display region 02. In thisembodiment of the present disclosure, the third insulating film 13 andthe fourth insulating film 14 are each cut off at the second cutoffposition L2 in the non-display region 02, and the edge of the thirdinsulating film 13 and the edge of the fourth insulating film 14 areflush. In this manner, during the manufacturing process of the displaypanel, when a second initial film is etched to form the third insulatingfilm 13, the fourth insulating film 14 may be used as a mask for etchingthe second initial film, so that a process is saved.

For example, referring to FIGS. 3 and 4 , the second cutoff position L2is located between the first cutoff position L1 and the display region01. The edge of the first insulating film 11 and the edge of the secondinsulating film 12 are further away from the display region 01 than theedge of the third insulating film 13 and the edge of the fourthinsulating film 14. Thus, the first insulating film 11 and the secondinsulating film 12 located in an upper layer may cover the edge of thethird insulating film 13 and the edge of the fourth insulating film 14located in a lower layer to seal the edge of the third insulating film13 and the edge of the fourth insulating film 14. In this manner, vaporand oxygen are prevented from entering the display region 01 of thedisplay panel from the edge of the third insulating film 13 and the edgeof the fourth insulating film 14.

In an embodiment, referring to FIGS. 1 to 4 , the first insulating film11 includes an inorganic layer. The first insulating film 11 includes aninorganic material. The second insulating film 12 includes an organiclayer. The second insulating film 12 includes an organic material. Inthis embodiment of the present disclosure, the second insulating film 12including the organic material is used as the mask to form the firstinsulating film 11 including the inorganic material by etching.

In another embodiment, the first insulating film 11 may include anorganic layer, and the second insulating film 12 may include an organiclayer.

In another embodiment, the first insulating film 11 may include anorganic layer, and the second insulating film 12 may include aninorganic layer.

In another embodiment, the first insulating film 11 may include aninorganic layer, and the second insulating film 12 may include aninorganic layer.

For example, referring to FIGS. 3 and 4 , the third insulating film 13and the fourth insulating film 14 each includes an inorganic layer, orthe third insulating film 13 and the fourth insulating film 14 eachincludes an organic layer. During the manufacturing process of thedisplay panel, the same etching method may be used for the thirdinsulating film 13 and the fourth insulating film 14 of the samematerial type. For example, dry etching is used for an inorganic layer,and an exposure and development method is used for an organic layer. Inthis manner, during the manufacturing process of the display panel, thesame mask is used, and in the same process, the third insulating film 13and the fourth insulating film 14 are simultaneously formed, so that aprocess is saved.

In an embodiment, referring to FIGS. 2 and 4 , the display panel alsoincludes a black matrix 21 and multiple color resists 22. The blackmatrix 21 is located in the display region 01 and the non-display region02. The black matrix 21 is formed with multiple openings 23 (one opening23 is used as an example in FIG. 2 and FIG. 4 ). The openings 23 arelocated in the display region 01. The color resists 22 are located inthe openings 23. The multiple color resists 22 are located in themultiple openings 23 separately. The multiple color resists 22 are eachlocated in the display region 01. The black matrix 21 includes an opaquematerial configured to block light transmission. The color resist 22 isconfigured to selectively filter the light transmitting the color resist22. For example, the multiple color resists 22 may include red colorresists, green color resists, and blue color resists. A red resist isconfigured to filter the light transmitting the red resist into red. Agreen resist is configured to filter the light transmitting the greenresist into green. A blue resist is configured to filter the lighttransmitting the blue resist into blue. The black matrix 21 and thecolor resists 22 are located between the first insulating film 11 andthe second insulating film 12. The second insulating film 12 covers theblack matrix 21 and the color resists 22. In this manner, when thesecond insulating film 12 is used as the mask to etch the first initialfilm to form the first insulating film 11, the second insulating film 12may protect the black matrix 21 and the color resists 22 to prevent theblack matrix 21 and the color resists 22 from being etched and thinned.

For example, referring to FIGS. 2 and 4 , the display panel includes aplanarization layer 24. The planarization layer 24 is configured tocover and protect the black matrix 21 and the multiple color resists 22.The second insulating film 12 is the planarization layer 24 in thedisplay panel. It is to be noted that the planarization layer 24indicates that the film is an organic layer and has a certainplanarization effect. The material of the planarization layer 24 is notlimited. In an embodiment, the planarization layer includes an adhesivelayer.

FIG. 5 is a top view of another display panel according to an embodimentof the present disclosure. FIG. 6 is a section view taken along sectionline CC′ of FIG. 5 . Referring to FIGS. 5 and 6 , the second insulatingfilm 12 includes a black matrix 21 and multiple color resists 22. Theblack matrix 21 is located in the display region 01 and the non-displayregion 02. The black matrix 21 is formed with multiple openings 23. Theopenings 23 are located in the display region 01. The color resists 22are located in the openings 23. In this embodiment of the presentdisclosure, a combined structure formed by the black matrix 21 and themultiple color resists 22 is used as the second insulating film 12, sothat the edge of the black matrix 21 is located at the first cutoffposition L1 in the non-display region 02. The edge of the black matrix21 is flush with the edge of the first insulating film 11.

In an embodiment, referring to FIGS. 5 and 6 , the display panel alsoincludes a planarization layer 24. The planarization layer 24 is locatedin the display region 01 and the non-display region 02. Theplanarization layer 24 is located on the side of the second insulatingfilm 12 facing away from the substrate 10. The planarization layer 24 isconfigured to cover and protect the black matrix 21 and the multiplecolor resists 22.

In an embodiment, referring to FIGS. 5 and 6 , the edge of theplanarization layer 24 is located at a third cutoff position L3 in thenon-display region 02. The first cutoff position L1 is located betweenthe third cutoff position L3 and the display region 01. The edge of theplanarization layer 24 is further away from the display region 01 thanthe edge of the first insulating film 11. In this manner, theplanarization layer 24 located in an upper layer may cover the edge ofthe first insulating film 11 located in a lower layer to seal the edgeof the first insulating film 11, thereby preventing vapor and oxygenfrom entering the display region 01 of the display panel from the edgeof the first insulating film 11.

FIG. 7 is a top view of another display panel according to an embodimentof the present disclosure. FIG. 8 is a section view taken along sectionline DD′ of FIG. 7 . Referring to FIGS. 7 and 8 , the display panel alsoincludes a third insulating film 13 and a fourth insulating film 14. Thethird insulating film 13 is located between the first insulating film 11and the substrate 10. The fourth insulating film 14 is located betweenthe first insulating film 11 and the third insulating film 13. The edgeof the third insulating film 13 and the edge of the fourth insulatingfilm 14 are each located at the second cutoff position L2 in thenon-display region 02. The second cutoff position L2 is located betweenthe first cutoff position L1 and the display region 01. The first cutoffposition L1 is located between the second cutoff position L2 and thethird cutoff position L3.

FIG. 9 is a top view of another display panel according to an embodimentof the present disclosure. FIG. 10 is a section view taken along sectionline EE′ of FIG. 9 . Referring to FIGS. 9 and 10 , the display panelalso includes a display function layer 25 and a thin-film encapsulationlayer 26. The display function layer 25 is located in the display region01. The display function layer 25 is located between the substrate 10and the third insulating film 13. The thin-film encapsulation layer 26is located in the display region 01 and the non-display region 02. Thethin-film encapsulation layer 26 is located between the display functionlayer 25 and the third insulating film 13. The thin-film encapsulationlayer 26 covers and seals the display function layer 25 and isconfigured to prevent vapor and oxygen from eroding the display functionlayer 25. The edge of an inorganic layer in the thin-film encapsulationlayer 26 (generally, the edge of the inorganic layer in the thin-filmencapsulation layer 26 is the edge of the thin-film encapsulation layer26) is located at a fourth cutoff position L4 in the non-display region02. The thin-film encapsulation layer 26 includes at least one inorganiclayer. The fourth cutoff position L4 is the furthest cutoff positionwhere the inorganic layer in the thin-film encapsulation layer 26extends. The fourth cutoff position L4 is located between the secondcutoff position L2 and the display region 01. The edge of the thirdinsulating film 13 and the edge of the fourth insulating film 14 arefurther away from the display region 01 than the edge of the inorganiclayer in the thin-film encapsulation layer 26. In this manner, the thirdinsulating film 13 and the fourth insulating film 14 located in an upperlayer may cover the edge of the inorganic layer in the thin-filmencapsulation layer 26 located in a lower layer to seal the edge of theinorganic layer in the thin-film encapsulation layer 26, therebypreventing vapor and oxygen from entering the display region 01 of thedisplay panel from the edge of the inorganic layer in the thin-filmencapsulation layer 26.

For example, referring to FIGS. 9 and 10 , the second cutoff position L2is located between the first cutoff position L1 and the fourth cutoffposition L4. The fourth cutoff position L4 is located between the secondcutoff position L2 and the display region 01. The first insulating film11 and the second insulating film 12 cover the edge of the thirdinsulating film 13 and the edge of the fourth insulating film 14. Thethird insulating film 13 and the fourth insulating film 14 cover theedge of the inorganic layer in the thin-film encapsulation layer 26.

FIG. 11 is a top view of another display panel according to anembodiment of the present disclosure. FIG. 12 is a section view takenalong section line FF′ of FIG. 11 . Referring to FIGS. 11 and 12 , thesecond cutoff position L2 is located between the first cutoff positionL1 and the fourth cutoff position L4. The fourth cutoff position L4 islocated between the second cutoff position L2 and the display region 01.The first cutoff position L1 is located between the second cutoffposition L2 and the third cutoff position L3. The planarization layer 24covers the edge of the first insulating film 11 and the edge of thesecond insulating film 12. The first insulating film 11 and the secondinsulating film 12 cover the edge of the third insulating film 13 andthe edge of the fourth insulating film 14. The third insulating film 13and the fourth insulating film 14 cover the edge of the inorganic layerin the thin-film encapsulation layer 26.

FIG. 13 is a top view of another display panel according to anembodiment of the present disclosure. FIG. 14 is a section view takenalong section line GG′ of FIG. 11 . Referring to FIGS. 13 and 14 , thefirst cutoff position L1 is located between the second cutoff positionL2 and the display region 01. The edge of the third insulating film 13and the edge of the fourth insulating film 14 are further away from thedisplay region 01 than the edge of the first insulating film 11 and theedge of the second insulating film 12. In this manner, the firstinsulating film 11 and the second insulating film 12 located in an upperlayer expose the third insulating film 13 and the fourth insulating film14 located in a lower layer. The exposed third insulating film 13 andthe exposed fourth insulating film 14 may be used as a protective layerto prevent the film located in the region between the first cutoffposition L1 and the second cutoff position L2 and located below thethird insulating film 13 from being damaged when the first insulatingfilm 11 is formed by etching.

FIG. 15 is a section view of another display panel according to anembodiment of the present disclosure. Referring to FIG. 15 , the regionbetween the first cutoff position L1 and the second cutoff position L2is an over-etching region. In the direction perpendicular to the planein which the substrate 10 is located, the sum of the thickness of thethird insulating film 13 and the thickness the fourth insulating film 14in the over-etching region is D1. In the direction perpendicular to theplane in which the substrate 10 is located, the sum of the thickness ofthe third insulating film 13 and the thickness the fourth insulatingfilm 14 in the display region is D2. D1 is smaller than D2. In thisembodiment of the present disclosure, due to the over etching of thefirst initial film when the first insulating film 11 is formed, thefourth insulating film 14 of a partial thickness in the over-etchingregion is etched off Alternatively, the fourth insulating film 14 of thefull thickness is etched off. Alternatively, the fourth insulating film14 of the full thickness and the third insulating film 13 of a partialthickness are etched off.

FIG. 16 is a section view of another display panel according to anembodiment of the present disclosure. Referring to FIG. 16 , the displaypanel also includes a first touch metal layer 31 and a second touchmetal layer 32. The first touch metal layer 31 is located between thethird insulating film 13 and the fourth insulating film 14. The secondtouch metal layer 32 is located between the fourth insulating film 14and the first insulating film 11.

For example, referring to FIG. 16 , the third insulating film 13 is abuffer layer configured to prevent vapor during the process fromentering the display device and match the stress of the thin-filmencapsulation. The fourth insulating film 14 is a touch insulating layerconfigured to space the first touch metal layer 31 and the second touchmetal layer 32. The first insulating film 11 is a touch insulating layerconfigured to cover the second touch metal layer 32.

In an embodiment, referring to FIG. 16 , the second insulating film 12is an organic layer, and the first insulating film 11 is an inorganiclayer. In one aspect, the second insulating film 12 may protect theblack matrix 21 and the multiple color resists 22. In another aspect,the second insulating film is used as the mask to etch the first initialfilm to form the first insulating film 11, that is, the protective layer(the second insulating film 12) of the black matrix 21 and the multiplecolor resists 22 on a side facing away from the substrate is used as amask to form a touch insulating layer (the first insulating film 11) byetching. Thus, there is no need to specially manufacture a mask when thefirst initial film 110 is etched, so that a process is saved, and theprocess flow of the display panel in the manufacturing process isreduced. Moreover, the production capacity of the display panel isimproved, and the manufacturing cost of the display panel is reduced.

For example, referring to FIG. 16 , the second touch metal layer 32 mayinclude multiple touch electrodes, which may be self-capacitive touchelectrodes or mutual capacitive touch electrodes. The first touch metallayer 31 may include a touch electrode wire connected to the touchelectrodes. In the case where the multiple touch electrodes are mutualcapacitive touch electrodes, the first touch metal layer 31 may includea bridge configured to connect two adjacent touch electrodes.

FIG. 17 is a section view of another display panel according to anembodiment of the present disclosure. Referring to FIG. 17 , the displaypanel includes a display function layer 25 and a driver circuit layer27. The display function layer 25 is located in the display region 01.The display function layer 25 is located between the substrate 10 andthe first insulating film 11. The driver circuit layer 27 is located inthe display region 01 and the non-display region 02. An inorganic layerin the driver circuit layer 27 is also formed with multiple grooves 28in the non-display region 02. The region in which a groove 28 is locatedis a groove region 021. The groove 28 can prevent the cutting crackgenerated in the inorganic layer of the driver circuit layer 27 frombeing conducted toward the display region 01 when the display panel iscut. The second insulating film 12 is the planarization layer 24. Thegroove region 021 is located between the first cutoff position L1 andthe display region 01. The second insulating film 12 covers the entireregion of the groove region 021. In an embodiment, the groove 28 may befilled with an organic layer (not shown in the figure).

FIG. 18 is a section view of another display panel according to anembodiment of the present disclosure. Referring to FIG. 18 , the displaypanel includes a display function layer 25 and a driver circuit layer27. The display function layer 25 is located in the display region 01.The display function layer 25 is located between the substrate 10 andthe first insulating film 11. The driver circuit layer 27 is located inthe display region 01 and the non-display region 02. The inorganic layerin the driver circuit layer 27 is also formed with multiple grooves 28in the non-display region 02. The region in which a groove 28 is locatedis a groove region 021. The second insulating film 12 is a combinedstructure formed by the black matrix 21 and the multiple color resists22. The first cutoff position L1 is located in the groove region 021.The second insulating film 12 covers a partial region of the grooveregion 021.

For example, referring to FIGS. 17 and 18 , the driver circuit layer 27includes multiple thin-film transistors 274 (only one thin-filmtransistor 274 is illustrated in FIGS. 17 and 18 ). The thin-filmtransistor 274 may include a source, a gate, a drain and a semiconductorlayer. The driver circuit layer 27 may also include a gate insulatinglayer 271, an interlayer insulating layer 272, and a source-drainpassivation layer 273 stacked in sequence in a direction perpendicularto the substrate 10. The groove 28 is formed in the non-display region02 by the gate insulating layer 271, the interlayer insulating layer272, and the source-drain passivation layer 273.

For example, referring to FIGS. 17 and 18 , the thin-film encapsulationlayer 26 includes a first inorganic encapsulation layer 261, an organicencapsulation layer 262 and a second inorganic encapsulation layer 263.The organic encapsulation layer 262 is located between the firstinorganic encapsulation layer 261 and the second inorganic encapsulationlayer 263. The second inorganic encapsulation layer 263 covers the edgeof the organic encapsulation layer 262 to prevent vapor and oxygen fromentering the organic encapsulation layer 262. The edge of the firstinorganic encapsulation layer 261 and the edge of the second inorganicencapsulation layer 263 are each located at the fourth cutoff positionL4. The edge of the thin-film encapsulation layer 26 is also located atthe fourth cutoff position L4.

FIG. 19 is a section view of another display panel according to anembodiment of the present disclosure. Referring to FIG. 19 , theplanarization layer 24 includes an organic layer. The planarizationlayer 24 includes an organic material. In an embodiment, theplanarization layer 24 includes a negative organic material, that is,the planarization layer 24 is a negative photoresist. In the directionperpendicular to the substrate 10, the planarization layer 24 has athickness of about 2 μm and has a tangent structure, and the formedslope angle θ satisfies: θ is greater than 0° and less than 90°.Typically, θ is between 70° and 90°. In the direction perpendicular tothe substrate 10, the first insulating film 11 has a thickness of about0.15 μm.

Typically, the thickness is between 0.1 μm and 1 μm. It is to be notedthat the surface on a side of the planarization layer adjacent to acutting edge may be a curved surface or a plane. FIG. 19 merely showsthat the surface on the side of the planarization layer adjacent to thecutting edge is a plane.

FIG. 20 is a flowchart of a manufacturing method of a display panelaccording to an embodiment of the present disclosure. FIG. 22 to FIG. 30are diagrams of the manufacturing process of a display panel accordingto an embodiment of the present disclosure. Referring to FIG. 20 andFIGS. 22 to 30 , the manufacturing method includes the steps below.

In S101, the substrate 10 is provided.

Referring to FIG. 22 , the substrate 10 is provided.

In S102, the first initial film 110 covering the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 26 , the entire first initial film 110 is formed onthe substrate 10. The first initial film 110 is located in the displayregion 01 and the non-display region 02.

In S103, the second insulating film 12 covering the display region 01and the non-display region 02 is formed. The edge of the secondinsulating film 12 is located at the first cutoff position L1 in thenon-display region 02.

Referring to FIG. 29 , the second insulating film 12 is formed on thefirst initial film 110. The second insulating film 12 is located in thedisplay region 01 and the non-display region 02. The edge of the secondinsulating film 12 is located at the first cutoff position L1. Thesecond insulating film 12 exposes the first initial film 110 located ina lower layer.

In S104, the second insulating film 12 is used as the mask. At leastpart of the first initial film 110 in the non-display region 02 isetched and removed to form the first insulating film 11. The edge of thefirst insulating film 11 is located at the first cutoff position L1.

Referring to FIG. 30 , the second insulating film 12 is used as the maskto etch the first initial film 110. The first initial film 110 notcovered by the second insulating film 12 is etched and removed to formthe first insulating film 11. The edge of the first insulating film 11is located at the first cutoff position L1.

The manufacturing method of a display panel provided by this embodimentof the present disclosure is used to form the display panel in thepreceding embodiments. After the first initial film 110 covering thedisplay region 01 and the non-display region 02 is formed, the firstinitial film 110 is not etched, but the second insulating film 12 isformed on the first initial film 110, and the second insulating film 12is used as the mask for etching the first initial film 110. Thus, thereis no need to specially manufacture a mask when the first initial film110 is etched, so that a process is saved, and the process flow of thedisplay panel in the manufacturing process is reduced. Moreover, theproduction capacity of the display panel is improved, and themanufacturing cost of the display panel is reduced.

FIG. 21 is a flowchart of a manufacturing method of a display panelaccording to an embodiment of the present disclosure. FIG. 22 to FIG. 30are diagrams of the manufacturing process of a display panel accordingto an embodiment of the present disclosure. Referring to FIGS. 21 to 30, the manufacturing method includes the steps below.

In S201, the substrate 10 is provided.

In S202, the second initial film 130 covering the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 23 , the entire second initial film 130 is formed onthe substrate 10. The second initial film 130 is located in the displayregion 01 and the non-display region 02.

In S203, a third initial film 140 covering the display region 01 and thenon-display region 02 is formed.

Referring to FIG. 24 , the entire third initial film 140 is formed onthe substrate 10. The third initial film 140 is located in the displayregion 01 and the non-display region 02.

In S204, at least part of the second initial film 130 in the non-displayregion 02 and at least part of the third initial film 140 in thenon-display region 02 are etched and removed. The third insulating film13 is formed from the second initial film 130. The edge of the thirdinsulating film 13 is located at the second cutoff position L2. Thefourth insulating film 14 is formed from the third initial film 140. Theedge of the fourth insulating film 14 is located at the second cutoffposition L2.

Referring to FIG. 25 , the second initial film 130 is etched to form thethird insulating film 13. The third initial film 140 is etched to formthe fourth insulating film 14. The edge of the third insulating film 13and the edge of the fourth insulating film 14 are each located at thesecond cutoff position L2.

In an embodiment, each of the third insulating film 13 and the fourthinsulating film 14 includes an inorganic layer. Alternatively, each ofthe third insulating film 13 and the fourth insulating film 14 includesan organic layer. During the manufacturing process of the display panel,the same etching method may be used for the third insulating film 13 andthe fourth insulating film 14 of the same material type. For example,dry etching is used for an inorganic layer, and wet etching is used foran inorganic layer. In this manner, during the manufacturing process ofthe display panel, the same mask is used, and in the same process, thethird insulating film 13 and the fourth insulating film 14 aresimultaneously formed, so that a process is saved.

In S205, the first initial film 110 covering the display region 01 andthe non-display region 02 is formed.

In S206, the black matrix 21 located in the display region 01 and thenon-display region 02 is formed. The black matrix 21 is formed withmultiple openings 23. The openings 23 are located in the display region01.

Referring to FIG. 27 , the black matrix 21 is formed. The black matrix21 is formed with the openings 23 in the display region 01.

In S207, a color resist 22 is formed in an opening 23.

Referring to FIG. 28 , the color resists 22 are formed in the openings23.

In S208, the second insulating film 12 covering the display region 01and the non-display region 02 is formed. The edge of the secondinsulating film 12 is located at the first cutoff position L1 in thenon-display region 02.

Referring to FIG. 29 , the second insulating film 12 is formed on theblack matrix 21 and the color resist 22. The edge of the secondinsulating film 12 is located at the first cutoff position L1. Thesecond insulating film 12 is the planarization layer 24. The secondinsulating film 12 covers the edge of the black matrix 21 to preventvapor and oxygen from entering the display region 01 of the displaypanel from the edge of the black matrix 21.

In an embodiment, the second cutoff position L2 is located between thefirst cutoff position L1 and the display region 01.

In S209, the second insulating film 12 is used as the mask. At leastpart of the first initial film 110 in the non-display region 02 isetched and removed to form the first insulating film 11. The edge of thefirst insulating film 11 is located at the first cutoff position L1.

In the manufacturing method of a display panel provided by thisembodiment of the present disclosure, on the basis of the precedingembodiments, the black matrix 21 and the color resists 22 are formedbetween the first insulating film 11 and the second insulating film 12,and the planarization layer 24 is used as the second insulating film 12.The second insulating film 12 is used as the mask to etch the firstinitial film 110 to form the first insulating film 11. Additionally, inthis embodiment of the present disclosure, after the second initial film130 covering the display region 01 and the non-display region 02 isformed, the second initial film 130 is not etched, but the third initialfilm 140 is formed on the second initial film 130, and then the secondinitial film 130 and the third initial film 140 are etched. In thismanner, there is no need to specially manufacture a mask when the secondinitial film 130 is etched, so that a process is saved, and the processflow of the display panel in the manufacturing process is reduced.Moreover, the production capacity of the display panel is improved, andthe manufacturing cost of the display panel is reduced.

It is to be understood that when the second initial film 130 and thethird initial film 140 are etched, since the third initial film 140covers the second initial film 130, the third initial film 140 is firstetched to form the fourth insulating film 14. Then the second initialfilm 130 is etched to form the third insulating film 13.

In an embodiment, the first insulating film 11 is an inorganic layer,and the second insulating film 12 is an organic layer. The organic layermay be regarded as a photoresist. The etching process of the organiclayer is the developing process of the organic layer. The patterningprocess of the organic layer includes exposing under a mask and thenetching (that is, developing). The patterning process of the inorganiclayer includes performing dry etching under a mask, for example, ionetching.

FIG. 31 is a flowchart of a manufacturing method of another displaypanel according to an embodiment of the present disclosure. FIG. 32 toFIG. 40 are diagrams of the manufacturing process of another displaypanel according to an embodiment of the present disclosure. Referring toFIGS. 31 and 40 , the manufacturing method includes the steps below.

In S301, the substrate 10 is provided.

Referring to FIG. 32 , the substrate 10 is provided.

In S302, the second initial film 130 covering the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 33 , the entire second initial film 130 is formed onthe substrate 10.

The second initial film 130 is located in the display region 01 and thenon-display region 02.

In S303, the third initial film 140 covering the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 34 , the entire third initial film 140 is formed onthe substrate 10. The third initial film 140 is located in the displayregion 01 and the non-display region 02.

In S304, at least part of the second initial film 130 in the non-displayregion 02 and at least part of the third initial film 140 in thenon-display region 02 are etched and removed. The third insulating film13 is formed from the second initial film 130. The edge of the thirdinsulating film 13 is located at the second cutoff position L2. Thefourth insulating film 13 is formed from the third initial film 140. Theedge of the fourth insulating film 13 is located at the second cutoffposition L2.

Referring to FIG. 35 , the second initial film 130 is etched to form thethird insulating film 13. The third initial film 140 is etched to formthe fourth insulating film 14. The edge of the third insulating film 13and the edge of the fourth insulating film 14 are each located at thesecond cutoff position L2.

In S305, the first initial film 110 covering the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 36 , the entire first initial film 110 is formed onthe substrate 10. The first initial film 110 is located in the displayregion 01 and the non-display region 02.

In S306, the black matrix 21 located in the display region 01 and thenon-display region 02 is formed. The black matrix 21 is formed withmultiple openings 23. The openings 23 are located in the display region01.

Referring to FIG. 37 , the black matrix 21 is formed. The black matrix21 is formed with the openings 23 in the display region 01.

In S307, a color resist 22 is formed in an opening 23.

Referring to FIG. 38 , the color resists 22 are formed in the openings23.

In S308, the second insulating film 12 is used as the mask. At leastpart of the first initial film 110 in the non-display region 02 isetched and removed to form the first insulating film 11. The edge of thefirst insulating film 11 is located at the first cutoff position L1.

The combined structure formed by the black matrix 21 and the multiplecolor resists 22 is used as the second insulating film 12. The secondinsulating film 12 is used as the mask. The first initial film 110 isetched to form the first insulating film 11.

In S309, the planarization layer 24 located in the display region 01 andthe non-display region 02 is formed.

Referring to FIG. 40 , the planarization layer 24 is formed on the blackmatrix 21 and the color resist 22.

In an embodiment, the edge of the planarization layer 24 is located atthe third cutoff position L3 in the non-display region 02. The firstcutoff position L1 is located between the third cutoff position L3 andthe display region 01.

In the manufacturing method of a display panel provided by thisembodiment of the present disclosure, on the basis of the precedingembodiments, the black matrix 21 and the color resist 22 are formed onthe first initial film 110, and the combined structure formed by theblack matrix 21 and the multiple color resists 22 is used as a mask toetch the first initial film 110 to form the first insulating film 11.

In an embodiment, referring to FIG. 10 , FIG. 12 , FIGS. 22 to 30 , andFIGS. 32 to 40 , before the second initial film 130 covering the displayregion 01 and the non-display region 02 is formed, the manufacturingmethod also includes the steps below.

The display function layer 25 located in the display region 01 isformed.

The thin-film encapsulation layer 26 in the display region 01 and thenon-display region 02 is formed.

The edge of an inorganic layer in the thin-film encapsulation layer 26is located at the fourth cutoff position L4 in the non-display region02. The fourth cutoff position L4 is located between the second cutoffposition L2 and the display region 01.

In an embodiment, referring to FIG. 16 , FIGS. 22 to 30 , and FIGS. 32to 40 , before the third initial film 140 covering the display region 01and the non-display region 02 is formed, the manufacturing method alsoincludes the steps below.

The first touch metal layer 31 is formed.

After at least part of the second initial film 130 in the non-displayregion 02 and at least part of the third initial film 140 in thenon-display region 02 are etched and removed, the third insulating film13 is formed from the second initial film 130, where the edge of thethird insulating film 13 is located at the second cutoff position L2,and the fourth insulating film 14 is formed from the third initial film140, where the edge of the fourth insulating film 14 is located at thesecond cutoff position L2, the manufacturing method also includes thesteps below.

The second touch metal layer 32 is formed.

An embodiment of the present disclosure provides a display device. FIG.41 is a diagram of a display device according to an embodiment of thepresent disclosure. Referring to FIG. 41 , the display device includesany display panel provided in embodiments of the present disclosure. Thedisplay device may be a mobile phone, a tablet computer, and a smartwearable device.

It is to be noted that the preceding are only preferred embodiments ofthe present disclosure and the technical principles used therein. It isto be understood by those skilled in the art that the present disclosureis not limited to the embodiments described herein. For those skilled inthe art, various apparent modifications, adaptations, combinations, andsubstitutions can be made without departing from the scope of thepresent disclosure. Therefore, while the present disclosure is describedin detail in connection with the preceding embodiments, the presentdisclosure is not limited to the preceding embodiments and may includeequivalent embodiments without departing from the concept of the presentdisclosure. The scope of the present disclosure is determined by thescope of the appended claims.

What is claimed is:
 1. A display panel, comprising a display region anda non-display region, wherein the non-display region is located at aperiphery of the display region, and the display panel comprising: asubstrate; a first insulating film located in the display region and thenon-display region and located on a side of the substrate, wherein anedge of the first insulating film is located at a first cutoff positionin the non-display region; and a second insulating film located in thedisplay region and the non-display region and located on a side of thefirst insulating film facing away from the substrate, wherein an edge ofthe second insulating film is located at the first cutoff position. 2.The display panel according to claim 1, further comprising: a thirdinsulating film located in the display region and the non-display regionand located between the first insulating film and the substrate, whereinan edge of the third insulating film is located at a second cutoffposition in the non-display region; and a fourth insulating film locatedin the display region and the non-display region and located between thethird insulating film and the first insulating film, wherein an edge ofthe fourth insulating film is located at the second cutoff position. 3.The display panel according to claim 2, wherein the second cutoffposition is located between the first cutoff position and the displayregion.
 4. The display panel according to claim 1, wherein the firstinsulating film comprises an inorganic layer, and the second insulatingfilm comprises an organic layer.
 5. The display panel according to claim1, further comprising: a black matrix located in the display region andthe non-display region, wherein the black matrix is formed with aplurality of openings, and the plurality of openings are located in thedisplay region; a plurality of color resists, wherein the plurality ofcolor resists are located in the plurality of openings; a displayfunction layer located in the display region and located between thesubstrate and the first insulating film; and a driver circuit layerlocated in the display region and the non-display region, wherein aninorganic layer in the driver circuit layer is further formed with aplurality of grooves in the non-display region, and a region in whichthe plurality of grooves are located is a groove region; wherein thegroove region is located between the first cutoff position and thedisplay region; and wherein the black matrix and the plurality of colorresists are located between the first insulating film and the secondinsulating film.
 6. The display panel according to claim 1, wherein thesecond insulating film comprises a black matrix and a plurality of colorresists; and the black matrix is located in the display region and thenon-display region, wherein the black matrix is formed with a pluralityof openings, the plurality of openings are located in the displayregion, and the plurality of color resists are located in the pluralityof openings.
 7. The display panel according to claim 6, furthercomprising: a planarization layer located in the display region and thenon-display region and located on a side of the second insulating filmfacing away from the substrate; wherein an edge of the planarizationlayer is located at a third cutoff position in the non-display region;and the first cutoff position is located between the third cutoffposition and the display region.
 8. The display panel according to claim6, further comprising: a display function layer located in the displayregion and located between the substrate and the first insulating film;and a driver circuit layer located in the display region and thenon-display region, wherein an inorganic layer in the driver circuitlayer is further formed with a plurality of grooves in the non-displayregion, and a region in which the plurality of grooves are located is agroove region; and the first cutoff position is located in the grooveregion.
 9. The display panel according to claim 2, further comprising: adisplay function layer located in the display region and located betweenthe substrate and the third insulating film; and a thin-filmencapsulation layer located in the display region and the non-displayregion and located between the display function layer and the thirdinsulating film, wherein an edge of an inorganic layer in the thin-filmencapsulation layer is located at a fourth cutoff position in thenon-display region; and the fourth cutoff position is located betweenthe second cutoff position and the display region.
 10. The display panelaccording to claim 2, wherein the first cutoff position is locatedbetween the second cutoff position and the display region; wherein aregion between the first cutoff position and the second cutoff positionis an over-etching region; and in a direction perpendicular to a planein which the substrate is located, a sum of a thickness of the thirdinsulating film in the over-etching region and a thickness of the fourthinsulating film in the over-etching region is D1, and a sum of athickness of the third insulating film in the display region and athickness of the fourth insulating film in the display region is D2,wherein D1 is smaller than D2.
 11. The display panel according to claim2, further comprising: a first touch metal layer located between thethird insulating film and the fourth insulating film; and a second touchmetal layer located between the fourth insulating film and the firstinsulating film.
 12. A manufacturing method of a display panel, whereinthe display panel comprises a display region and a non-display region,and the non-display region is located at a periphery of the displayregion; and the manufacturing method comprises: providing a substrate;forming a first initial film covering the display region and thenon-display region; forming a second insulating film covering thedisplay region and the non-display region, wherein an edge of the secondinsulating film is located at a first cutoff position in the non-displayregion; and using the second insulating film as a mask and etching andremoving at least part of the first initial film in the non-displayregion to form a first insulating film, wherein an edge of the firstinsulating film is located at the first cutoff position.
 13. Themanufacturing method according to claim 12, before forming the firstinitial film covering the display region and the non-display region,further comprising: forming a second initial film covering the displayregion and the non-display region; forming a third initial film coveringthe display region and the non-display region; and etching and removingat least part of the second initial film in the non-display region andat least part of the third initial film in the non-display region,forming a third insulating film from the second initial film, wherein anedge of the third insulating film is located at a second cutoffposition, and forming a fourth insulating film from the third initialfilm, wherein an edge of the fourth insulating film is located at thesecond cutoff position.
 14. The manufacturing method according to claim13, wherein the second cutoff position is located between the firstcutoff position and the display region.
 15. The manufacturing methodaccording to claim 12, wherein the first insulating film is an inorganiclayer, and the second insulating film is an organic layer.
 16. Themanufacturing method according to claim 12, before forming the secondinsulating film covering the display region and the non-display region,wherein the edge of the second insulating film is located at the firstcutoff position in the non-display region, further comprising: forming ablack matrix located in the display region and the non-display region,wherein the black matrix is formed with a plurality of openings, and theplurality of openings are located in the display region; and formingcolor resists in the plurality of openings.
 17. The manufacturing methodaccording to claim 12, wherein forming the second insulating filmcovering the display region and the non-display region, wherein the edgeof the second insulating film is located at the first cutoff position inthe non-display region, comprises: forming a black matrix located in thedisplay region and the non-display region, wherein the black matrix isformed with a plurality of openings, and the openings are located in thedisplay region; and forming color resists in the plurality of openings;wherein after using the second insulating film as the mask and etchingand removing the at least part of the first initial film in thenon-display region to form the first insulating film, wherein the edgeof the first insulating film is located at the first cutoff position,the method further comprises: forming a planarization layer located inthe display region and the non-display region; wherein an edge of theplanarization layer is located at a third cutoff position in thenon-display region; and the first cutoff position is located between thethird cutoff position and the display region.
 18. The manufacturingmethod according to claim 13, before forming the second initial filmcovering the display region and the non-display region, furthercomprising: forming a display function layer located in the displayregion; and forming a thin-film encapsulation layer located in thedisplay region and the non-display region, wherein an edge of aninorganic layer in the thin-film encapsulation layer is located at afourth cutoff position in the non-display region; and the fourth cutoffposition is located between the second cutoff position and the displayregion.
 19. The manufacturing method according to claim 13, beforeforming the third initial film covering the display region and thenon-display region, further comprising: forming a first touch metallayer; and after etching and removing the at least part of the secondinitial film in the non-display region and the at least part of thethird initial film in the non-display region, forming the thirdinsulating film from the second initial film, wherein the edge of thethird insulating film is located at the second cutoff position, andforming the fourth insulating film from the third initial film, whereinthe edge of the fourth insulating film is located at the second cutoffposition, further comprising: forming a second touch metal layer.
 20. Adisplay device, comprising a display panel comprising a display regionand a non-display region, wherein the non-display region is located at aperiphery of the display region, and the display panel comprises: asubstrate; a first insulating film located in the display region and thenon-display region and located on a side of the substrate, wherein anedge of the first insulating film is located at a first cutoff positionin the non-display region; and a second insulating film located in thedisplay region and the non-display region and located on a side of thefirst insulating film facing away from the substrate, wherein an edge ofthe second insulating film is located at the first cutoff position.